Semiconductor light-emitting diodes have epitaxial sheets, chips, devices and application products, from the perspective of the industrial chain there are substrate production, epitaxial, chip, device packaging, application product production, the substrate is the base, in the substrate growth to make epitaxial sheets, the epitaxial sheet through the chip production process, and then the chip packaging into the device, in the device packaging into application products.
Substrate production and epitaxial production is the upstream of the industrial chain, with high technical content; Chip production for the middle of the industrial chain; Devices and application products are made for the downstream of the industrial chain, and the technical content is low.
Chip epitaxy provides device designers with great flexibility in optimizing device performance, such as the ability to control epitaxy layer doping thickness, concentration, and wheel path, which are independent of the silicon substrate.
This control can be achieved by doping during epitaxial growth.
Chip epitaxy can also reduce latching effects in CMOS devices.