igbt chip manufacturing process:
1. Pre-finishing grinding: wash and clean the raw material wafer, grinding to remove surface contamination.
2. Wafer fusing: The raw material wafer is divided into many small pieces in order to better fuse into the appropriate size.
3. Coating thick film: Coating the film with accurate thickness, controlling the thickness and appearance of the layer.
4. Corrosion: passivation corrosion to remove excess film layer.
5. Lithography: Etching specific shapes and patterns on the wafer surface.
6. Gold plating: Add a thin film on the wafer surface to improve its electrical conductivity.
7. Burn: Burn the circuit on the wafer to complete the final circuit design.
8. Test: The wafer performance test and inspection.
9. Package: Package the wafer to make it a usable integrated circuit product.