Huawei Kirin A1 chip is the world's first Bluetooth 5.1 and BLE 5.1 dual-certified wireless chip, which was first released at IFA 2019. Compared to the Apple H1, it has about 30% better performance and 50% lower power consumption.
The Kirin A1 chip is very small in size, only 4.3mm x 4.4mm, and can be implanted in wearable devices. Its internal main components, including AP, RAM, Bluetooth, DSP, sensor matrix, power management module and so on.
Kirin A1 chip is a BT\/BLE dual-mode 5.1 wearable chip. The Kirin A1 chip measures 4.3mm x 4.4mm and integrates a Bluetooth processing unit, an audio processing unit, a low-power application processor and a separate power management unit.
The Kirin A1 uses BT-UHD Bluetooth codec technology with a maximum transmission bandwidth of 6.5 Mbps.