1, the basic principle of IC packaging
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On the one hand, the integrated circuit package plays the role of installing, fixing, sealing, protecting the chip and enhancing the electric heating performance. On the other hand, it is connected to the pins of the package housing through contacts on the chip, and these pins are connected to other devices through wires on the printed circuit board, thus achieving the connection of the internal chip to the external circuit.
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At the same time, the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit, leading to a decline in electrical performance. In the process of integrated circuit packaging, the oxide and particle contaminants on the chip surface will degrade the product quality. These contaminants can be effectively removed if plasma cleaning is performed during packaging before loading, lead bonding, and plastic curing.
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2, IC packaging process
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Only when encapsulated in the IC packaging process can it become a terminal product and be put into practical application. The integrated circuit packaging process is divided into pre-process, intermediate process and post-process. With the continuous development of integrated circuit packaging technology, great changes have taken place.
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The front-end process can be divided into the following steps:
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(1) Patch: Use a protective film and a metal frame to fix and cut the silicon wafer into a silicon wafer, then a single piece;
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(2) Slicing: the silicon wafer is cut into a single chip and inspected;
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(3) Chip mounting: put the silver glue or insulating glue on the corresponding position on the lead frame, remove the cut chip from the scribing film, and paste it on the fixed position of the lead frame;
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(4) Bonding: Use gold wire to connect the lead hole on the chip and the pin on the frame pad to connect the chip to the external circuit;
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(5) Package: The circuit of the package component. The physical properties of the enhanced component protect the component from external damage;
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(6) Post-curing: curing plastic packaging materials, so that it has enough hardness and strength to undergo the entire packaging process.
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The pollutants in the integrated circuit packaging process are important factors affecting its development. How to solve these problems has been puzzling people. On-line plasma cleaning technology is a dry cleaning method without environmental pollution, which can effectively solve this problem.
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Plasma cleaning equipment is the use of plasma to activate the surface of the sample, the sample surface to remove pollutants, but also to improve its surface performance, improve product quality.
IC packaging process is the process of packaging chips into usable electronic components. Generally, the following steps are involved:
1. Chip cutting: The chip is cut into a single chip.
2. Welding: Weld the chip to the package substrate.
3. Wiring: wiring on the substrate to connect chips and other components.
4. Packaging: The substrate and chip are encapsulated in a plastic or metal shell.
5. Test: Test the packaged chip to ensure that it meets the specifications.
6. Label: Label the chip model, batch and other information on the package shell.
7. Packaging: Put the packaged chip into the packaging box for transportation and sales. The above steps may vary, depending on the package type and chip specifications.