The core materials for making chips are divided into: the first generation of semiconductor materials (mostly high-purity silicon, which is widely used at present), the second generation of compound semiconductor materials (gallium arsenide, indium phosphide), and the third generation of compound semiconductor materials (silicon carbide, gallium nitride).
Among them, silicon carbide because of its superior physical properties - high band gap width (corresponding to high breakdown electric field and high power density), high conductivity, high thermal conductivity, will be the most widely used in the future to make semiconductor chip basic materials.