1, Determine the test sample chip aging test : select the TO252-5L package chip that needs to be subjected to HAST test chip aging test, and confirm that it meets the test requirements. Prepare test equipment: ReadyHAST test equipment, test fixtures, heaters, pressure vessels, etc. Install the test fixture: Install the chip on the test fixture to ensure a firm and stable installation. 2, for the chip, the common chip aging test test conditions such as 110℃, 85%RH, 264 hours, HAST test acceleration factor can be up to hundreds of times, which means that in a short time to simulate the actual use of several years or even decades, Greatly reduce the chip burn-in test product risk. However, the HAST test is not bulletproof. It may accelerate the glass transition of some polymer materials, resulting in unreal failure. Therefore, it is important to understand and control these factors.
3, SmartBeam technology: The United States portable alloy analyzer INNOV-X ALPHA-2000 uses SmartBeam technology both X-ray tube expertise and multi-beam filtration technology to achieve extraordinary stability, detection speed and service life of the alloy analyzer and has excellent upgrade potential. Intelligent analysis makes it rightAutomatic compensation for irregular or small sample tests, including thin strips, seams, and corners of welded points.
1, the purpose is to carry out high temperature aging test. The high temperature oven can simulate the working condition of the chip in extreme high temperature environment to evaluate the stability and reliability of the chip in high temperature environment. By heating the chip for a long time under high temperature conditions, potential problems that may exist can be detected, for exampleSuch as temperature caused performance changes, aging of materials, loosening of welding points and so on.
2, design temperature above 1000℃. Warranty and maintenance: Do not place this box in a corrosive environment containing acid and alkali to avoid damage to electronic parts. When you need to move, do it carefully and gently to avoid loosening of internal electrical line contacts after severe vibration. Pay attention to protect the exterior paint of the box, otherwise, it will not only affect the appearance of the box, but more importantly, it will shorten the life of the box.
3, the detection of the weldability of components can be held by stainless steel tweezers and immersed in 235±5℃ or 230±In a tin pot at 5℃, remove at 2±0.2s or 3±0.5s. Check the solder end under a 20-fold microscope, requiring more than 90% solder end of components. As a processing workshop, the following appearance checks can be done: Visually or with a magnifying glass, check whether the welding end or pin surface of the component is oxidized or has no contaminants.
4, you can also use manual expansion, but it is easy to cause bad problems such as chip drop waste. LED dispensing Silver glue or insulating glue is placed on the corresponding position of the LED bracket. (For GaAs, SiC conductive substrates, red light, yellow light, yellow green chips with back electrodes,Using silver glue. For blue and green LED chips on sapphire insulating substrate, insulating adhesive is used to fix the chip.
5, After the acid and alkali empty bottle is cleaned with water, and according to the plastic bottle, the glass bottle is placed separately in the outdoor recycling cylinder. Hydrofluoric acid will corrode bones, if touched immediately apply calcium gluconate with water, then rinse with water, and seek medical attention. When encountering other acids and bases, rinse them with DI Water immediately. After cleaning, the Wafer should be placed in DI Water to avoid contamination.