plug-in has large power chip , stabilityGood chip , good heat dissipation characteristics chip , which is not comparable to the patch. Chip components are often at the expense of performance in exchange for volume, in many places with accuracy requirements, such as Agilent's network analyzer, spectrum analyzer, almost the vast majority of all are in-line devices.
In general, the symbols for in-line components are more intuitive because they accurately show the pin position and orientation of the component. The symbol of the patch type component is more simplified and does not display explicit pin information, but stillThe connection relationship between components can be indicated by connecting wires. Which type of component you choose to use depends on factors such as the needs of the circuit design, PCB layout and manufacturing process.
Small size Chip : The chip component is smaller, which is conducive to reducing the overall size of the product. Solid welding: Because the patch component is firmly connected to the circuit board by welding, its connection stability is high, and the seismic performance is strong. High degree of automation: The assembly automation of the patch components is high, which can improve production efficiency.
Different meaning: SMTPatch refers to a series of process processes on the basis of PCB, PCB (Printed Circuit Board) is a printed circuit board. SMT is the Surface assembly Technology (Surface Mounted Technology) (short for Surface Mounted technology), is the most popular technology and process in the electronic assembly industry.
Integrated circuit is a special process, the transistor, resistor, capacitor and other components integrated on the silicon substrate and formed with a certain function of the device, the English abbreviation for IC, also known as chip.Integrated circuits appeared in the 1960s, when only a dozen components were integrated. Later, the integration level became higher and higher, and today's P-III was also produced.
Its components include a bracket (supporting the LED pin and conducting electricity), silver glue (adhering to and conducting electricity), and gold wire (connecting the positive and negative poles). The characteristics of the in-line LED lamp beads are significant, such as low energy consumption (efficient up to 160mw), rich color, easy to use, and no complex circuit design. For example, 3mm, 5mm, 8mm and 10mm plug-in leds are suitable for different application scenarios such as indicators, lighting, billboards, etc.
The temperature is 343±10℃; 2, welding color ring resistor, ceramic capacitor, tantalum capacitor, short circuit block and other components of the electric soldering iron temperature at 371±10℃; 3, maintenance of general components (including IC) soldering iron temperature within 350±20℃; Repair power modules with thick pins, transformers (or inductors), large electrolytic capacitors and large area copper foil pad soldering iron temperatures at 400±20℃.Before welding, check whether the chip pin is complete, whether there is damage, whether the pad is intact, and whether there is a bad spot, and then weld after confirming the completion. Then a solder joint of the pad is tinned, mainly forPosition the chip to prevent shifting. Position the chip correctly and secure it to the pad to ensure correct position.
Welding method Before welding, apply flux on the pad and treat it with a soldering iron to avoid poor tinning or oxidation of the pad, resulting in poor welding, and the chip generally does not need to be treated. Carefully place the PQFP chip onto the PCB board with tweezers, taking care not to damage the pins. Align it with the pad to ensure that the chip is placed in the correct direction.
And for the chip with many pins and multi-sided distribution, it is difficult to fix the chip with one foot, so it is necessary to fix the chip with multiple pins, oneGenerally, the method of fixing the foot can be used. That is, after welding and fixing a pin, the pin opposite the pin is welded and fixed, so as to achieve the purpose of the whole chip is fixed.
1, the stripe chip identification direction for some double-in-line or double-row chip , the surface of the chip has a horizontal chip , which is the direction identification point of the chip pin.The chip is placed flat chip , the left side of the bar is the first pin chip , the right side is the last pin, the pin label increases in counterclockwise direction, the chip identification direction of the dot is a circular dot identification method. Very common for dual-in-line chips.
2, the font faces itself, from left to right are e, b, c three poles, and the lower left foot of the patch is the base b, the lower right corner is the emitter e, the top is the collector c. The S9013 triode is an NPN type triodeThe tube, silicon as the main material, belongs TO a small power triode, this triode is very common, there are plug-in TO-9 patch SOT-23 two kinds of package, it has three pins, respectively, base b, collector C, emitter e.
3, visual inspection patch chip : After the patch is completed, the appearance of the chip pin is observed by visual inspection. Pay attention to observe whether there is a pin bend, dislocation, fracture and other phenomena. This is the simplest and most commonly used detection method. X-ray inspection: The position and shape of the chip pins can be checked non-destructively using X-ray equipmentI do. X-rays can penetrate the housing material to reveal the structure and location of the internal pins. This method is usually used by specialized laboratories or manufacturers.
4, for some double-in-line or double-row patch, the surface of the chip has a transverse, which is the direction identification point of the chip pin. The chip is laid flat, the left side of the bar is the first pin, the right side is the last pin, and the pin label increases in a counterclockwise direction. The dot identification method is very common for dual-in-line chips. This dot is the orientation point. The identification method is similar to the identification method with stripes.
5, a single foot up, is the collector, the next left foot is the base. C, B, and E are mostly like this, but just to be on the safe side, it's best to test again and make sure.
1, the package shape is different, the welding process is different, and the rated power consumption of some components and patches will be different.
2, patch and in-line are common forms of chip packaging, they are the same in function, but the chip size of the patch is smaller, relative to the in-line chipIt will also consume less power. However, the in-line chip also has its advantages, if the hole plate is welded, the chip package is not good for welding.
3, the direct insertion of components and the patch type are two common installation methods, and they have some differences in symbol representation. In-line: In-line components are inserted directly into pre-drilled holes on the printed circuit board (PCB) through pins. In the circuit diagram, the symbol of the in-line component is usually represented by a rectangle, and the pin is represented by a straight line.