1, in summary, focused ion beam (FIB) as a precision detection and manufacturing tool in chip manufacturing, its excellent performance,Flexibility and versatility undoubtedly provide key support for modern chip factories. It not only improves the accuracy of material analysis, but also promotes the innovation of microelectronics technology, laying a solid foundation for the future development of nanotechnology.
2, FIB, or focused ion beam technology, it uses liquid gallium metal (usually) as the ion source, through the acceleration and precision focusing of the ion gun, can fine manipulate the sample surface on the micro and nano scale. This technique is similar to SEM in that it can not only observe the surface morphology of the sample, but also perform selective material removal or deposition, opening up entirely new possibilities in the field of microelectronics.
And then by incubating the sample on the chip for reaction combination, and then using the chip scanner for detection technology. (2) Liquid phase cytokine chip based on magnetic beads.analysis: The technology that can detect the molecular weight of cytokines is protein chip method (C pair). Protein chip is a technology that can trap the target protein in the sample when reacting with the protein sample to be measured, and then carry out qualitative and quantitative analysis of the target protein through the detection system.
According to different types of analysis, a variety of strategies are used, more thanFor example, in the competition analysis of drug abuse, the analyte will compete with the antibody and bind to the fixed site; In the cytokine chip, the sandwich method is used, that is, the cytokine is first bound to the antibody, and then the labeled antibody is added to detect the presence of the cytokine.
1, visual inspection: After the patch is completed, the appearance of the chip pin is observed through visual inspection. Pay attention to observe whether there is a pin bend, dislocation, fracture and other phenomena. This is the simplest and most commonly used testThe method. X-ray inspection: The position and shape of the chip pins can be checked non-destructively using X-ray equipment. X-rays can penetrate the housing material to reveal the structure and location of the internal pins. This method is usually used by specialized laboratories or manufacturers.
2. The pin will be checked. The chip ic is measured with a multimeter, and the resistance value between each pin of the ic needs to be measured, and whether the on-off is abnormal to determine the quality of the component. In the chip system, the computer vision detection technology is used to check the pin of the ic, which has high accuracy and high reliability.
3. Check. According to Baidu Encyclopedia,The chip will check the pin of the ic. The chip ic uses a multimeter to measure the resistance value between each pin of the ic and whether it is abnormal to determine the quality of the component. A large electrolytic capacitor is found in the circuit, and its nominal voltage is between 20 and 35v, and the ic pin connected at the positive end of the power supply is the chip power pin.
4, the reasons for the poor suction components of the placement machine insufficient vacuum negative pressure When the suction nozzle takes the components, the suction nozzle produces a certain negative pressure, the element is adsorbed on the suction mouth, and the negative pressure detection method is generally used to determine whether the pick up components of the suction nozzle is abnormalWithin a certain range, the machine thinks that the absorption is normal, and on the contrary, it thinks that the absorption is poor.
5, first say the cause of virtual welding BGA package, before the chip on the machine, first check the surface finish of the ball pin of the BGA chip, whether there is oxidation or stains, whether it is wet. Then check the brand of solder paste used in the patch to see if the quality is good. In addition, it is necessary to check whether the surface process treatment effect of the pcb carrier is up to the standard. Here, by the way, it is best to do the surface treatment of the PCB board with BGA package, and do not do ordinary lead-free tin spray.
6, component pin deformation; Components and componentsPin oxidation; Due to SMT equipment factors caused by the welding machine in PCB transmission, positioning action is too fast, inertia is too large caused by heavy components shift; The SPI solder paste detector and AOI inspection equipment did not detect the relevant solder paste coating and mounting problems in time.
2, offline detection of the IC chip between the pin to the ground between the positive and negative resistance value. It is compared with a good IC chip to find the fault point. On-line detection of DC resistance is the same as offline detection.
3,First, make sure the computer is turned off and disconnected from the power supply. Open the computer case and locate the memory power chip. Insert the red probe of the multimeter into the positive pin of the chip and the black probe into the negative pin. Make sure the probe is firmly in contact with the metal pins of the chip and that it does not touch anywhere else. Next, adjust the multimeter to the DC voltage measurement mode.
In summary, chip detection , voltage detectionThe chip plays the role of guardian in the voltage management of the MCU chip detection , ensuring the reliability and efficiency of the reset process by accurately detecting and controlling the voltage. Whether during power-on start-up, voltage fluctuations, or power-on and power-off testing, they are integral components to ensure stable MCU operation.
Ensures the normal output of the chip. According to the use of the chip, the chip will not output the set voltage, after reaching the opening voltage, the chip will output normally, and the chip should have the starting voltage to ensure that the chip can be output normally. Chip refers to the inclusion of integrationA small piece of silicon that is part of a cell phone, computer, or other electronic device.
The voltage is stable and the current is sufficient. The reference voltage is generally provided to the specific function module of the chip, for example, the analog-to-digital conversion module requires a conversion reference voltage (which may be different from the power supply voltage), and the chip may contain other analog circuits that require other voltage values. If the reference voltage required by the chip is the same as the supply voltage, it can also be connected to the supply voltage via isolators (components such as inductors).
Its working principle is: when the input voltage changes, the voltage regulator coreThe chip detects this change and adjusts the output voltage to keep it at a specific voltage level. The voltage regulator chip usually consists of a comparator, an amplifier, and a feedback circuit.
This is a standard voltage, usually by the chip output a very stable voltage, the need to regulate the output voltage through the circuit and this voltage comparison, the chip will know the output is too high or too low, and finally adjust the output voltage and the voltage is consistent, to maintain the output voltage stability. It can also be understood as the law of this power supply, and whether the output voltage is illegal or does not fulfill the obligation is identified by this standard.