2, the first glance identification/original packaging, the important tips of the label background color is unique, light yellow background, the first finger icon is clearly visible, the spacing of the arrow and the circle is not confused; In contrast, the non-original label has an orange-yellow base color, the finger icon lines are blurred, and the combination of circles and arrows is closely connected and recognizable at a glance. The subtleties of the Focus on Detail /AD logo cannot be overlooked either.
3, the brand information can be logged in Jindian technology networkStation. Or directly to the electronic market to sell goods, the goods on the market are mixed, we must learn to distinguish the authenticity of IC! There are two methods for removing old pieces: hot air method, this method is a regular practice, used for cleaner and tidy plates, especially the more valuable SMD board. Frying, which is true, is done with a mixture of high boiling mineral oil, which is usually done with very old or very messy garbage boards.
4, look at the printing. The vast majority of today's chips use laser marking or printing with a dedicated chip printer, the handwriting is clear, neither conspicuous, nor fuzzy and difficult to erase. Refurbished chips either have jagged edges corroded by cleaning agentsEither the printing is blurred, the depth is not correct, it is easy to erase or it is too conspicuous. Look at the pin.
5, different printing. icberlin genuine chips are laser marked or printed with a dedicated chip press, and the writing is clear, unobtrusive, not blurry and difficult to erase. The chip of the imitation product is either the edge of the writing is corroded by the cleaning agent and has a jagged feeling, or the printing is fuzzy, the depth is different, the position is not correct, it is easy to erase or is too conspicuous.
6, directly dial the bank 400 phone, enter your ID number, the end of the 4 can be true. Even safer, if you can activate itIndustry standard
The grade of chip IC products is mainly divided by its outer packaging and production status, and the grade is arranged alphabetically from A to E. Grade A1, that is, new original goods, representing the original factory production and maintain the original packaging, anti-static packaging is complete, usually from formal channels or independent distributors, enjoy the highest product reliability within the specified warranty period.
The definition of product grade is mainly based on the outer packaging of the product, the grade is arranged alphabetically from A to E: A1 grade: original production, original packaging, anti-static packaging complete (description: from regular channels or independent distributors, in the specified qualityDuring the warranty period, the product reliability is the highest.
Touch chips, especially electronic components that utilize single or multi-touch technology. A chip, or Integrated Circuit (IC), is a small circuit module consisting of a variety of electronic components integrated on a silicon plate to perform a specific function.
Touch ic: The soul builder of electronic devices Touch ic, simply put, is an integrated chip that combines single or multi-touch technology in one, giving electronic devices the ability to sense and respond to finger touch. It's not an isolated chip, it's an electronic deviceThe indispensable core component of the standby, which tightly integrates computing and storage functions on the silicon chip, is like the brain of the electronic device, driving the execution of various operations.
1, what is the fiber laser marking machine Fiber laser marking machine is the use of fiber laser production of laser marking machine, is the use of laser beam in a variety of different substances on the surface of the permanent mark. The marking effect is through the surface matterThe evaporation of the material reveals the deep material, or marks the physical changes of the surface material caused by light energy, or burns part of the material through light energy, showing the patterns, characters, bar codes and other graphics required to be etched.
2, the fiber laser marking machine is made of ytterbium-doped double-clad fiber as the laser medium, so that the high-power fiber laser can get the beam output close to the diffraction limit, the fiber laser is used as the base film output, the focused spot diameter of 10 microns, and then the computer controls the high-speed scanning mirror deflection to change the laser beam path to achieve automatic marking.
3, fiber laser marking machine byPower supply system, laser, cooling system, optical scanning system, Q switch, focusing system, etc. Ac power supply respectively to the computer, Q switching power supply, cooling circulation pump, laser power supply, HE-NE laser power supply.
4, is the use of CO2 gas as the working medium of the laser galvanometer marking machine.
5, fiber laser marking machine is the use of laser beam on a variety of different substances on the surface of the permanent mark. The marking effect is through the evaporation of the surface material to expose the deep material, or through the physical change of the surface material caused by light energy to carve out traces, or through the light energy to burn off the partSubmaterial, showing the required etching pattern, text, bar code and other graphics.
6, cabinet type fiber laser marking machine can go to the local 58 city or Ganji network to search the relevant information, or find in the large machinery factory. < / p > < h2 id = 'chip manufacturing process - chip production (chart)' > chip manufacturing process - chip production (chart) < / h2 >The transition from polysilicon to monocrystalline silicon is a gorgeous metamorphosis from a natural element to a high-tech product. Through 12 key steps, we have witnessed the magic of siliconBrigade: The birth of polysilicon, the crystallization process of diamond lattice arrangement. Crystal growth, pure presentation of monocrystalline silicon. Crystals are trimmed and ground to ensure the perfect shape of the wafer. Precise slice and edge rounded, fine grinding.
Wafer material The composition of silicon wafer is silicon, silicon is refined from quartz sand. Silicon wafers are purified by silicon elements (99.999%) and made into silicon rods, which become quartz semiconductor materials for manufacturing integrated circuits. A chip is a specific chip needed for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the requirements on the process. Wafer coatings Wafer coatings can resist oxidation and temperature to their materialIt is a photoresist.
Chip material: The main component of silicon is silicon, which is obtained by refining quartz sand. High purity silicon (up to 9999%) is used to make silicon rods, which are ultimately converted into quartz semiconductor materials, the basis of integrated circuits. In chip manufacturing, the specific wafer required is called a wafer, and the thinner the wafer, the lower its production cost, but the higher the requirements for the manufacturing process.
Mainly manufactures digital signal processing chips, which generally require 1500 processing steps from start to finish. First, when performing complex component assembly, theyWill be responsible for transporting the chip to the various workstations, and then use photolithography to design the circuit on the chip, the lens is first coated with a photosensitive chemical, when the photosensitive chemical contact with ultraviolet light will harden, in a closed dark room, the light will first pass through the circuit design shadow.
The production process of the chip is roughly divided into the following steps: Raw materials of the single Wafer: The raw materials of the chip production are mainly Silicon Wafer, which is a round sheet of high-purity silicon. Lithography: The circuit pattern that needs to be made is exposed and repaired on the silicon wafer with special equipment, that is, colorPhotolithography is then used to chemically form patterns.
1, in the bright star of semiconductor equipment, the back-channel sealing equipment is like a bright pearl, driving the precision process of chip manufacturing. These devices cover both packaging and testing, and the key equipment in each link is constantly improved in precision and process innovation. Packaging equipment: precision is like micron-level art, as fine as hairThe accuracy requirements determine the yield rate and enterprise cost. 2, semiconductor production equipment: driving the core force of scientific and technological revolution Semiconductor special equipment in today's field of science and technology plays a vital role, it is like the engine of the industry, promoting the vigorous development of the entire industrial chain. This sophisticated ecosystem can be divided into two main phases: front wafer manufacturing and back package testing. Among them, the front path is based on the CZ method, and the single crystal growth furnace is like a lamp to illuminate the birth of the silicon wafer.
3. The return of high-end chip industry chain and the rise of domestic testing industry make the market division more clear.The testing process is gradually independent of the encapsulation. The expansion of domestic fabs has made testing demand keep pace with industry growth, and the revenue of test service manufacturers is more stable. Professional third-party testing manufacturers in the patented technology and testing technology beyond the integrated enterprises, injected new vitality into the market.