Depending on whether it is a 90 nm process or a 90 nm lithography machine. The 90nm process is too different from the current mainstream 7nm to be suitable for mobile phone chips, because mobile phone chips pursue small size and low power consumption. If it is a 90 nm lithography machine, it is not a chip that is 90 nm, and it can be exposed three times to reach the 14 nm level.
If the chip manufacturing process is compared to a pyramid, a towerThe tip is the 10nm and above process, 14nm and 90nm are the tower waist, and below 90nm is the base. Speaking of this, the strategic significance of the domestic 90nm lithography machine is shown.
Based on the national extreme risk, a domestic lithography machine with an accuracy of 90nm must exist. At the national level, the accuracy and process of the lithography machine are definitely the more advanced the better. China definitely wants to be able to enter the 7nm, or even higher precision level. Unfortunately, the reality of the situation has a variety of difficulties, so that our country has no way to enter the high precision level of chip manufacturing process in a short time.
Many people thinkAdvanced in the high-end field, is a high level.
China's chip manufacturing capacity has reached the 90nm level. In the key links of chip manufacturing, such as photolithography machines, etchers, wafers, photoresist and other equipment and materials, the proportion of localization still needs to be improved. Especially in the field of lithography machines, Shanghai Microelectronics has been able to produce 90-nanometer level equipment. However, high-end KrF and ArF photoresist are almost entirely dependent on imports, and the localization of ArF photoresist is almost zero.
ZTE's self-sufficiency rate in the field of base station chips is almost zero, which has become the biggest problem it faces in the embargo event. Base station chipComplexity raises the industry threshold, making it difficult for domestic players to enter the field. Although the ZTE incident exposed China's shortcomings in the field of high technology, there are also scholars optimistic that China's level in the field of artificial intelligence can be comparable to the United States.
China's chip manufacturing technology is currently capable of reaching the 14nm level. In the face of the challenges of domestic chip development, in addition to the challenges of the external environment and the continued sanctions of the United States, which limit access to key technologies and industries, China's chip industry is also trying to enhance its own capabilities through labor-intensive methods. Although progress has been made, compared with the international advanced level, there is still a gapBig gap.
3. Wei Shaojun: Information technology is the main driving force of the global economy, especially China's economic development. The new infrastructure focuses on the digital economyInfrastructure, including 5G, industrial Internet, artificial intelligence, big data centers, etc., these belong to the information technology industry, even UHV, rail transit, new energy vehicle charging pile and other projects also contain a large number of information technology products.
4, ST Shanghai Technology Co., LTD. ST Shanghai Technology Co., Ltd. was established by public offering, listed on the Shanghai Stock Exchange on March 27, 1992. Mainly for high-tech industry investment, industrial investment, investment management, technical services, technical training and so on. Zhangjiang Hi-Tech Park is renownedThe Silicon Valley of China.
1, NM "90NM" we usually say that the CPU nano production process is not a processing line 90 nm chip is what level , in fact refers to a process size 90 nm chip is what level , It means integrating tens of thousands of them on a single silicon waferThe width of the wire between the transistors. According to the technical description, what is the level of the 90 nm chip , that is, the width of the gate circuit and the connection between the gate circuit of the most basic functional unit on the chip. Take the 90nm manufacturing process as an example what level is the 90nm chip , at this time the connection width between the gate circuit is 90nm.
2, nm is x360 cpu is manufactured by 65nm process, 90nm is x360 cpu is manufactured by 90nm process. The 65nm process is more advancedIn, less heat, can reduce the power consumption and heat of the host. However, only the cpu is limited to 90 nm chip what level 65nm process, the culprit of three red gpu still uses 90nm process (no matter what version), so it is still difficult to eradicate three red.
3, the CPU power consumption is smaller. Since 1971, the chip manufacturing process has experienced 10 microns, 6 microns, 3 microns, 5 microns, 1 micron, 800 nanometers, 600 nanometers, 350 nanometers, 250 nanometers, 180 nanometers, 130 nanometersMeters, 90 nm, 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm, all the way to the current (2019) the latest 7 nm, and 5 nm will be the development goal of the next generation of cpus.
4, nm). More advanced manufacturing processes allow the CPU to integrate more transistors inside the GPU, giving the processor more power and higher performance. More advanced manufacturing processes will reduce the thermal design power (TDP) of processors to address the barrier of processor frequency increase; More advanced manufacturing processes can also increase the core area of the processorStep reduction, that is, more CPU and GPU products can be manufactured on the same area of wafer.
1, China's domestic chips can now reach the process level of 90 nm. In the key links of chip manufacturing, equipment and materials such as lithography machine, etching machine, wafer, photoresist occupy an important proportion. In particular, lithography equipment, at present, Shanghai microelectronics enterprises have been able to provide 90 nm level products. However, at the high end KrF and ArF photoresistThe self-sufficiency rate of domestic products is almost zero, and it is heavily dependent on imports.
2, domestic chip level can only achieve 90 nm. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm. High-end KrF and ArF photoresist are almost dependent on imports, of which ArF photoresist is almost zero domestic. Therefore, China wants to produce highly localized chips, and at present 90 nm is a demarcation point.
3, according to the current data show that China's chips can only reach 14 nm, but the United States in chip manufacturing can reach five nm, this quantitative advantage means that their development is more robust, but even so the United States did not want to let go of China, and even in some application and development has been limited to China, which shows that the gap between Chinese chips and foreign chips is far.
4, China's domestic chip can reach 90 nm. Domestic chip level can only achieve 90 nanometers. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm. high-endKrF and ArF photoresist are almost dependent on imports, of which ArF photoresist is almost zero domestic.
1, the nanoscale division of the chip includes 3nm, 5nm, 7nm, 14nm and so on. Where 90 nm chip is what level , the nanometer level refers to the gate length of the CMOS device, that is, the minimum wiring width or processing size. Globally, TSMC and Samsung's 3nm process technology is more advanced, but the current Samsung 3nThe yield of m is only 10-20%. What level is 90 nm chip China's most advanced process technology is SMIC's 14nm.
2, precision process, high-end process and low-end process. According to the query core network, the precision process is the process below 13 nm, such as 9 nm, 7 nm, 5 nm, and the most precise is 3 nm. High-end processes between 13 nm and 28 nm belong to high-end processes. Low-end processes are processes above 28 nm for low-end processes, such as 130 nm, 90 nm processes.
3, chip nm grade division: 3nm chip, 5nm chip, 7nm chip, 14nm chip and so on. A chip is simply a transistor that takes a circuit and its 90 nm chip is what level he device is made on a piece of semiconductor (from Jeff Dahmer). Chip is the carrier of integrated circuit. Here, nm actually refers to the gate length of the CMOS device, which can also be understood as the minimum wiring width or minimum processing size.
4, to 45 nm for the mid-end chip, other low-end chips, so 12 nm chip is highEnd chip, 22 nm chip is the middle chip. 12nm chips are currently basically made by high-end EUV lithography mechanism, so 12nm chips are high-end chips, and the application of high-end chips is currently the era of 4 to 7 nm, and chips above 10 nm are usually used in low-end devices, so 12nm belongs to high-end chips in low-end applications.