1, wet wash (with various reagents to keep the surface of the silicon wafer free of impurities).
2, wet washing steps: by using different chemical reagents to ensure that the surface of the silicon wafer is free of impurities, keep it clean. Photolithography: Using ultraviolet light to shine through a mask on a silicon wafer, the areas hit become fragile and can be easily removed, while the unirradiated areas remain intact. In this way, the desired pattern can be formed on the silicon wafer. It should be noted that at this time, no impurities have been introduced on the silicon wafer.
3, the steps of chip manufacturing include sand and silicon separation, silicon purification, silicon casting into silicon ingots, wafer processing, lithography, etching and ion implantation, copper filling, gluing, and making another layer of structure. 1 Chip manufacturing requires 5,000 processes, involving more than 50 industries and 2000-5000 processes.
4, chip manufacturing process mainly includes wafer preparation, lithography, etching, ion implantation, film deposition, chemical mechanical polishing, metallization, testing and packaging steps. These steps are linked together to ensure the high quality and performance of the chip. Detailed wafer preparation: The wafer is the coreThe basis of wafer manufacturing, it is a round silicon wafer.
Production of upper and lower electrodes: vacuum evaporation, electroless nickel plating or aluminum paste printing sintering and other processes. First make the lower electrode chip process , and then make the upper electrode. Aluminum paste printing is a widely used process. (8) The production of anti-reflection film: the chip process reduces the inlet reflectionLoss chip process , to cover a layer of anti-reflection film on the surface of the silicon wafer. The materials for making anti-reflection film are MgF2 chip process , SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5 and so on.
Solar chips, usually referred to as solar panels, are semiconductor devices that directly convert solar light energy into electrical energy. The core part of the solar panel is the solar cell, which mainly uses the solar energy through the photovoltaic effectConvert to electricity. The process flow of solar cells includes the preparation of cells, the series of cells, the assembly, testing and packaging of panels.
Solar chips, usually referred to as solar panels, are semiconductor devices that directly convert solar light energy into electrical energy. The core part of the solar panel is the solar cell, which works by using the photovoltaic effect to convert the electron-hole pair generated by sunlight into a usable current. Solar cells are mainly divided into silicon solar cells and non-silicon solar cells.
It can be seen that the solar cell chipThe process method used for manufacturing is basically the same as that of semiconductor devices, and the process equipment produced is basically the same, but the process processing accuracy is far lower than the manufacturing requirements of integrated circuit chips, which provides favorable conditions for the large-scale production of solar cells.
The PN structure can be formed on the silicon chip. Finally, the calibration test is carried out, and the qualified silicon wafers can be assembled into solar panels for generating electricity and converting light energy. The whole process looks complicated, but the principle is not difficult to understand. It is to first have a pure silicon wafer, and then create a PN structure that can absorb light energy and convert it into electricity. The period requires careful control of eachIon implantation, heat treatment and packaging. Each step requires strict control of parameters to ensure the performance and reliability of the final product. Wafer cleaning Specifically, wafer cleaning is to remove impurities such as dust, contaminants, and oils from the surface of the wafer and improve the success rate of subsequent process steps.
2, in the key steps, once the process indicators run out of the limit, the risk of chip manufacturing failure will be greatly increased. Therefore, the more advanced the process, the more to ensure the stability of the process.
3, the purpose of the lithography machine is to produce chips. Photolithography is part of the semiconductor chip production processThe most complex and critical process steps are time-consuming and costly. The difficulty and key point of semiconductor chip production is how to produce the target circuit pattern on the silicon wafer, which is realized by lithography, and the process level of lithography directly determines the process level and performance level of the chip. 4, in the chip manufacturing industry, lithography machine is an essential precision equipment, is the most complex integrated circuit chip manufacturing, the most critical process step, lithography machine exposure resolution is directly related to the wavelength, in more than half a century, wavelength lithography technology light source scale is shrinking, which has been recognized by the chip industry as a new generationThe dominant lithography technology is EUV lithography using a light source with a wavelength of 15 nanometers.
5, repeat this step, you can get a purer silicon chip is how to make? How the chip is made is as follows: Chip design. The chip is a product of small size but high precision. If you want to make a chip, design is the first step. The design needs to use EDA tools and some IP cores, and finally make the chip design blueprint required for processing. Sand and silicon separation. All semiconductor processes start with a grain of sand.
2, chip manufacturing process mainly includes wafer preparation, lithography, etching, ion implantation, film deposition, chemical mechanical polishing, metallization, testing and packaging steps.These steps are linked together to ensure the high quality and performance of the chip. Detailed wafer preparation: Wafer is the basis of chip manufacturing, it is a round piece of silicon.
3, creativity and blueprint: the starting point of design First of all, the birth of the chip from the designer's innovative thinking. According to the needs of customers, they drew a fine circuit diagram, selected 9999% pure silicon rod as raw material, and began the chip process the journey of creating the micro-world.
Chip manufacturing The steps of the chip process include sand and silicon separation, silicon purification, silicon casting into silicon ingots, wafer processing, photolithography, etching and ion implantation, copper filling, gluing, and making another layer of structure. 1 Chip manufacturing requires 5,000 processes, involving more than 50 industries and 2000-5000 processes.
The dry etching technique is used to remove the material in a specific area to form the platform pattern of the chip. After removing the etchingThe temporary glue layer. The chip is annealed to improve its electrical and optical properties. A layer of SiO2 is deposited as a window layer, protecting the chip while allowing light to pass through. 1. Lithography of window graphics is performed to define the luminous window of the LED chip. 1 Corrode the SiO2 window layer to form the desired window shape.
The production process generally divides the production of LED into three parts: upper, middle and downstream. The single crystal rod is made into a single crystal rod, and then the single crystal rod is cut into thin slices with a diamond knife (mainly sapphire and, SiC, Si). The long crystal furnace grows - takes out the crystal rod - rolls the grinding - quality inspection - slicing - grinding - pourAngle - Polishing - cleaning - Quality inspection -OK.
In general, the LED production process is divided into two parts of the chip process: First, the production of gallium nitride (GaN) based epitaxial sheet on the substrate, this process is mainly done in the metal-organic chemical vapor deposition epitaxial sheet furnace (MOCVD). After preparing the material source and various high purity gases required for the production of GAN-based epitaxial sheet, the epitaxial sheet can be gradually made according to the requirements of the process.
Install the power supply: check whether the aluminum substrate is crooked, stick tight, and put the power supply from the aluminum substrateThe side with "LED" and "LED-" is loaded into the aluminum tube, the white wire end is loaded first, the longer white wire is threaded to the other side of the aluminum tube, and the power supply is put into the aluminum tube.
LED welding process has two kinds of gold wire ball welding and aluminum wire pressure welding. First press the first point on the LED chip electrode, and then pull the aluminum wire to the corresponding bracket above, press the second point and pull off the aluminum wire. The gold wire ball welding process burns a ball before pressing the first point, and the rest of the process is similar. Welding wire is the key link in LED packaging technology, the main need to monitor the process is gold wire (aluminum wire) arch wire shape, solder joint shape, tension.
The semiconductor production process consists of wafer fabrication, wafer testing, chip packaging and post-package testing. Semiconductor packaging refers to the process of processing individual chips from tested wafers according to product models and functional requirements.
From the original material (wafer) chip process , the package test plant process begins with wafer surface coating (WTP). The back of the wafer is then ground (GRD), wafer back polishing (polish), wafer back film (W-M). After that, wafer surface removal (WDP), wafer baking (WBK), and wafer cutting (SAW) are performed. The wafer is cleaned after cutting (DWC) and inspected after cutting (PSI).
Reliability Chip process , like the lifeline of the chip chip process , directly determines its service life. The packaging process is composed of wafer thinning, cutting, mounting, molding and other steps.It is divided into anterior segment (FOL) and posterior segment (EOL). The FOL process is rigorous and meticulous, including the back thinning to protect the circuit, cutting into Die, cleaning and impurity removal, light inspection and removal of defects, and then the key links such as chip paste, silver paste curing, and lead welding.
Packaging process Chip process : From wafer cutting, to the fine attachment of individual chips, to lead bonding or flip chip bonding, each step ensures a seamless connection between the chip and the outside world. Finally, package protection and rigorous testing ensure the electrical performance, functionality and speed of the product.