With the slowdown of investment in the closed test plant, the proportion of the Chinese market has increased, and the growth of local demand and domestic substitution have mutually promoted the market expansion. The expansion of IC design enterprises and sealing and testing plants has mushroomed to drive the growth of the testing machine market. Especially in the probe card market, MEMS probe card as the mainstream, its domestic alternative space is huge, and the products of domestic manufacturers such as Lin Weina have international market competitiveness, but still face the challenge of competitive landscape.
First, the construction and application of 5G will bring huge increments to the semiconductor industry. 5G communication networks need to build base stations, equipment to transmit signals, and need a large number of semiconductors. Fashionable applications such as big data, smart cities, cloud computing, medical IT, government IT, and unmanned driving derived from 5G need more semiconductor components to run on computers and other terminals. Second, the domestic substitution space is very large.Tongfang Guoxin (002049) : Tongfang Guoxin benefited from the increase in the penetration rate of military chip localization and the horizontal expansion of military memory. China's military chip marketKirin chip foundry. At present, the domestic chip manufacturing level is still at the general level, and there is no high-end chip manufacturing capacity. The people should strengthen themselves. In May 2019, the Trump administration added Huawei to the entity list, restricting US companies from supplying Huawei.
This chip not only represents the pinnacle of Huawei's technology, but also the crystallization of hisilicon's wisdom. The rise of Huawei Kirin chip In the 3G chip war, Huawei Kirin as a "dark horse" like the rise, with its excellent performance, won the market's wide recognition. Since its inception in 2004, Kirin has focused on the research and development of industrial chips for networking and video applicationsFor strong support.
All of Qualcomm's product lines, including PCS, mobile phones and other chips, have stopped supplying Huawei. Although Qualcomm has said it will provide products to Huawei as much as possible, Huawei has continued to reduce its reliance on Qualcomm chips due to the uncertainty. The data show that the share of Qualcomm chips in Huawei's phones and other equipment has fallen from 24 percent in the past to about 8 percent.
Hisilicon K3V2 Hisilicon Kirin appeared in the 3G chip war, with the "dark horse" attitude, has received the attention of the industry. After the 4G era, it has developed to the top of the industry with continuous breakthroughs in technology, proving domestic chipsThe strength of... Huawei's first real chip is the K3V2 released in 2012, K3V2 is made of ARM architecture 40NM and 64-bit memory bus, there are two main frequency, one is 2GHz, one is 5GHz.
And the Kirin processor, the pride of Huawei, once hit the market with a dark horse attitude. Founded in 2004, Huawei focused on industrial-grade chip research and development, initially focusing on network and video application support, but it was not until 2009, with the launch of the K3 processor, Huawei officially entered the smartphone processor field, becoming China's first self-developed intelligentCreator of mobile phone processors.
1, a few days ago, Geishi Automobile was informed by the new official of four dimensional Map that its wholly-owned subsidiary AutoChips Jiefa Technology car level MCU product line has added a member - AC7801X. This is the first 32-bit Cortex-released by Jefa Technology following the mass production of the first car-scale MCU chip - AC7811 - at the end of 2018The M0 MCU chip is designed to further expand the market share of four-dimensional new in the field of domestic body control.
2. In 2017, Jefa Technology was newly acquired by Beijing Siwei Graph, deeply integrated into the new "data algorithm chip" soft and hard integration development strategy of SIwei Graph. In the future, it will focus on the layout of automatic driving, car networking, and intelligent cockpit, and make medium and long-term planning and technology development roadmap. Specific projects include the advanced intelligent cabin chip AC802AC8035; The new generation of car networking chip AC826 vision processing chip AC6815 and so on.
2. As of 2018, there are only six pure wafer foundries with advanced process technology of 28nm and below, including TSMC, GF, Hedian chip parent company UMC, SMIC, Fateman and Hualivu, and three manufacturers below 14/16nm including TSMC, GF and UMC. At present, TSMC is the only pure-play foundry that can provide 7nm manufacturing services. Master the most advancedThe process technology, in addition to the domestic alternative chip technology to pass, but also to have large-scale capital investment.
3, many people think that China's chip manufacturing process is not good, indeed, the current domestic lithography machine can only reach 90nm accuracy, the best domestic chip foundry SMIC process level is only between 28nm-14nm. However, chip manufacturers can find technologically advanced foundrings, such as Huawei's Kirin 970 and Apple's mobile phone chips are made by TSMC. From the chip manufacturing process itself, chip manufacturing belongs to the industrial chainDownstream, China and the US are outsourced.
Recently, BYD action frequently. First, BYD signed an agreement with Huawei hisilicon, in which BYD will purchase Huawei Kirin 710A chips to build a digital car cabin. In addition, the introduction of strategic investors in BYD Semiconductor has aroused another concern in the industry for domestic chips, because there are many star-studded Chinese companies on the BYD semiconductor war investment listBusiness name, such as millet, Lenovo, etc.
It is understood that Huawei Kirin chip is independently exploring the application in the field of automotive digital cockpit, the first product is Kirin 710A, and has signed a cooperation agreement with BYD. Byd responded by saying: "We have obtained Kirin's chip technical documentation and started to develop it." "Kirin chip has been expanding the auto market for several months, and it is currently mainly locked in BYD, hoping to open the market with the help of models."
BYD entered the IGBT industry in 2005 and launched the first vehicle scale IGBT 0 technology in 2009The monopoly of international manufacturers has been broken, and China has achieved zero breakthrough in automotive IGBT chip technology. Yang Qinyao, director of BYD semiconductor products, said recently that BYD's IGBT has gone to the 5th generation, silicon carbide mosfet has gone to the 3rd generation, and the 4th generation is under development.
And when enterprises in various industries are searching for semiconductor chips, there is a car company that has not only built its own semiconductor industry chain, which can fully guarantee its own supply, but also some of the surplus can be market-based operation. On December 2, BYD Semiconductor won the 2020 Top 500 Global Unicorn companies, in the UnicornTop 100 companies on the list. Although China is now facing chip difficulties, it does not mean that we do not have the ability to manufacture chips in the later stage.