"Integrated circuit testing" belongs to the emerging compound and accumulation of experience in the developmentA type of occupation, with high-tech characteristics. With the separation of the three industries of the integrated circuit industry, there are more and more design companies (Fabless) (nearly 500 in the country), and the market segment of the test industry continues to expand, and the development prospects are very broad. The driving force for the development of "integrated circuit testing" also depends on the country's industrial policy trends, the improvement of comprehensive national strength, and the improvement of the overall quality of talents.
Integrated circuit technology professional employment direction, detailed introduction as follows: Electronic components direction: Electronic components is one of the main fields of integrated circuit technology application, including semiconductor devices, integrated circuits, electronic components and so on. this598. Automotive chips generally refer to vehicle gauge level chips. Car gauge chip, automotive components. Vehicle gauge class is a specification standard applicable to automotive electronic components.
2, what are the leading stocks of semiconductor Jinbo shares (sh688598) company is mainly engaged in the research and development, production and sales of advanced carbon composite materials and products, currently focusing on carbon/carbon composite materials and products, mainly used in the photovoltaic industry of crystalline silicon manufacturing thermal field system, It is a high-tech enterprise with independent research and development ability and continuous innovation ability.
3, semiconductor plate leading stock Jiejie micro: Jiangsu Jiejie microElectronics Co., Ltd. specializes in the research and development, design, production and sales of power semiconductor chips and equipment. It intends to raise no more than 19.5 billion yuan to enter the field of automotive power semiconductors.
1, LED chip test microscopy: whether there is mechanical damage on the surface of the material and pitting pits lockhill chip size and electrode size can meet the process requirements electrode pattern can be complete. LED expansion because the LED chips are still closely spaced after slicingSmall (about 0.1mm), not conducive to the operation of the post-process. The film of the bonded chip is expanded by a spreader, so that the spacing of the LED chip is stretched to about 0.6mm.
2. Put silver glue or insulating glue on the corresponding position of the LED support. (For GaAs, SiC conductive substrates, red light, yellow light, yellow-green chips with back electrodes, silver glue is used. For blue and green LED chips on sapphire insulating substrate, insulating glue is used to fix the chip.) The difficulty of the process is the control of the dispensing amount, and there are detailed process requirements in the colloidal height and dispensing position.
3,After the wafer is cut into the chip, 100% eye inspection (VI/VC) is performed by the operator under a microscope with a magnification of 30 times. Then a fully automatic classifier is used to select, test and classify the chips according to different voltage, wavelength and brightness prediction parameters. Finally, the LED chip is inspected (VC) and labeled.
4, LED, chip inspection, color temperature. Luminous flux color coordinates, color rendering index, etc., these parameters need to be tested by integrating spheres.
In the bright star of semiconductor equipment chip automatic sorter , the back-channel sealing equipment is like a bright pearl, driving the precision process of chip manufacturing. These devices cover both packaging and testing, and the key equipment in each link is constantly improved in precision and process innovation. Packaging equipment chip automatic sorting machine : precision is like a micron-level art, as subtle as the accuracy of the hair requirements decide chip automaticSorting machine the yield and enterprise cost.
Welding machine: The welding machine is used to attach the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use. Chillers: Chillers are used to cool chips to get more accurate results when testing.
Semiconductor production equipment: the core force driving the scientific and technological revolution Semiconductor special equipment in today's scientific and technological fieldIt plays a vital role as the engine of the industry, promoting the vigorous development of the entire industrial chain. This sophisticated ecosystem can be divided into two main phases: front wafer manufacturing and back package testing. Among them, the front path is based on the CZ method, and the single crystal growth furnace is like a lamp to illuminate the birth of the silicon wafer.
Semiconductor packaging equipment generally have solder paste printing machine, solid crystal machine, reflow welding, light detection, repair equipment, etc., among which the most core is solid crystal machine, our company's production line is Zhuoxing Semiconductor solid crystal machine, very easy to use, the performance is very powerful.