2, the multimeter detection memory is good or bad method, the motherboard to the memory data pin is generally in order to protect the memory data pin, in each data pin are addedThere is a resistance with a small resistance, which plays a current limiting role, and the resistance value is generally about 10 ohms.
3, power off, find the chip First, turn off the computer and disconnect the power, open the chassis to find the memory power chip. Connect the red probe of the multimeter to the positive electrode and the black probe to the negative electrode to ensure stable contact. Adjust the multimeter to detect voltage Next, adjust the multimeter to DC voltage mode and it will display the supply voltage. Usually, the memory power supply chip voltage is 3V or 5V. Compare the reading with the standard value. If it is consistent, the power supply is normal. If it is inconsistent, there may be problems.
4. Turn on the multimeter switch to testEvery pin of the laptop memory. Red pen to ground (pin 1), black pen to measure the resistance of negative discharge resistance. The resistance value of the data bit of the memory chip is the same as that of the damaged place. The above describes how to test the memory bar of a notebook using a multimeter.
5, the motherboard can not trigger the gray line of the power strip through a triode or gate circuit (244,245) controlled by the IO chip and the south bridge, and then from the IO and south bridge to the PW-ON pin.
Set the measuring range: Turn the multimeter knob to the resistance measurementMeasure the file and select an appropriate range. Typically, a range is chosen that is slightly larger than the expected resistance value of the chip. Disconnect the power supply: Before measuring the resistance, make sure the chip is powered off to avoid damaging the chip or multimeter. Connect the test pin: Connect it to the chip pin using the multimeter's probe. Know which pins should be measured according to the data book.
Starting with the original material (wafer), the process flow of the package test plant begins with wafer surface coating (WTP). Then the wafer back grinding (GRD), wafer back polishing (polish), wafer back coating (W-M). After that, wafer surface removal (WDP), wafer baking (WBK), and wafer cutting (SAW) are performed. The wafer is cleaned after cutting (DWC) and inspected after cutting (PSI).
First consult the chip data manual for pin functions and electrical specifications. Rotate the multimeter to the resistor to ensure that the chip is powered off to prevent baby injury! Touch the correct pin with the probe as instructed in the data manual. Multimeter display value, is the resistance value! Voltage Measurement Tips Understand power requirements and operating voltage ranges. Switch to DC voltage and select the appropriate voltage range. Connecting coreChip to power supply. Use a probe to measure the voltage.
Under the guidance of the design concept of building a test platform based on programmable devices, we implemented the following methods of building a functional test platform: Chun Heng uses programmable logic devices to generate input incentives and process output responses; Using ROM to store DSP kernel program, control register parameters, pulse compression coefficient and filter coefficient; Use SRAM as an external cache.
How to test the clock chip of the 4th generation Apple motherboard For the clock chip test of the 4th generation Apple motherboard, you first need to connect the chip to the test device. The test equipment can be specificThe test requires a 50pF capacitive load, and the HS-TX's TSKEwcal-SYNC /Tskewcal measurement imposes strict requirements on high-speed clock and data calibration respectively. The test process, as illustrated by HS-TX TSkewcal-Sync & Tskewcal, shows the detailed waveform analysis.
3, chip test execution: according to the test plan, the test instrument is used to test the chip. Test instruments can include multimeters, oscilloscopes, logic analyzers, signal generators, etc. During the test, strictly follow the test plan, record test data and test results. Chip test data analysis: Analyze and process the test data to verify the performance and reliability of the chip.
4. package test is the test carried out after the chip is packaged into the finished product. Since the chip is already packaged, the clean room environment is no longer required, and the conditions required for testing are greatly reduced. Generally, package test equipment is also developed or customized by each manufacturer, and usually contains sensors to test various electronic or optical parameters, but usually does not use probes to probe into the chip (most chips cannot be probed after packaging).Instead, test directly from the pin connection.