中文English
静电防护芯片ichaiyang 2024-05-31 22:31 88
1, Chip anti-static level four standards 2, Integrated Circuit Electrostatic TLP Test and Analysis 3, The three factors that affect the chip most 4, What does the nanochip fear...

Electrostatic protection chip (anti-static chip box)

Four standards for anti-static rating of the chip

1, the anti-static level is usually divided according to the different levels of electrostatic sensitive components, generally divided into four levels. These four levels are: electrostatic discharge sensitive level Electrostatic discharge sensitive level Electrostatic discharge sensitive level 3 and electrostatic discharge insensitive level. Electrostatic discharge sensitivity Level 1: This is the most sensitive level at which components are extremely vulnerable to electrostatic discharge.

2, the forward voltage drop of different colors of light emitting tubes is different. It can be seen from the photoelectric effect, eU=hν, U is the forward voltage drop, the frequency of different colors of light is different ν, so U is different.

3, ESD20 standard is fully promoted by ESDA (Electrostatic Discharge Protection Association) manufacturers recognized standards, the association is composed of electronic components manufacturers, users, mainly IBM, MOTOROLA and other companies, The OEM factories or suppliers of these companies must be accredited by ESDS20 certification in order to obtain and maintain OEM and supply product qualification.

4, LED chip electrostatic sensitivity is relatively high, the production environment is relatively dryDry, all directly operated semi-finished products, finished product production lines are classified as I level; (2) Only the storage and transportation of the device does not require strict anti-static measures, because the product is not processed at this time.

Electrostatic TLP Test and Analysis of Integrated Circuits

Integrated circuit static TLP test: In-depth analysis and application In today's rapidly changing science and technology, the integration and complexity of electronic products continue to rise, from intelligent devices to automatic driving, everywhere high-density integrated devices require extremely high electrostatic protectionPerformance. Transmission Line Pulse (TLP) test technology, as an important tool in this field, plays a key role in electrostatic discharge protection design.

TLP: Tran *** ission Line Pulse, transmission line pulse generator, is a research and test method of integrated circuit electrostatic discharge protection technology.

No negative resistance region exists in TLP curve. Hysteretic ESD devices include NPN triode, gate grounded NMOS, controllable cinnamon and so on. Non-hysteretic ESD deviceComponents include diodes, diode strings, channle-operated MOS tubes, PNP triodes, GDPMOS for grid-connected power supplies, etc. Compared with hysteresis ESD devices, the TLP curve has no negative resistance region. Devices commonly used for ESD protection include PN junction diodes, GGNMOS structures and SCR structures.

TLP351 is widely used in semiconductor devices, integrated circuits and electronic components breakdown voltage test. It can quickly and accurately evaluate the voltage resistance of devices and provide important references for device design and manufacturing. In addition, TLPp>

One of the important factors is the structural design of the circuit inside the chip. In addition, factors such as manufacturing technology, process engineering and temperature also affect the speed at which the chip works. The increase of clock frequency, the reduction of signal delay, and the acceleration of circuit switching speed will directly affect the working speed of the chip.

Area and integration: chip area: need to consider the physical size of the chip, usually the smaller the area, the lower the cost, but also need to ensure the rationality of the layout, to avoid signal interference and electromagnetic interference. Integration: Determine the functional modules integrated in the chip and what functions are consideredIt can be integrated on one chip to improve the overall performance of the system.

What do nanochips fear most

1, fear of pulse weapons. In theory, nanorobots could achieve many medical achievements. However, in the past ten to twenty years, due to various factors, the desired results have not been achieved. For example, the manufacturing is difficult, the lack of perfect standards and so on.

2, the hospital to do CD certainly can not be found, to do nuclear magnetic resonance nanochip nanomaterials a variety of implanted into the inspection must have a paragraphTime, or even a long time in years, then your chip may be integrated with the human body, which is difficult to check, which is the chip plus hypnosis and drug mind control.

3. Electrostatic discharge. Electrostatic discharge is the main culprit of excessive electrical stress damage caused by electronic components and chips. Because static electricity is usually a very high instantaneous voltage (several thousand volts), this damage is permanent and devastating, causing the circuit to burn directly. The human chip is a chip that can be implanted in the human body using radio frequency identification technology, which contains a chip, antenna and information transmitter.

How to anti-static chips

1. Yes. According to the website, when the electronic finished chip produces static electricity, it can be used to coat the antistatic agent to solve the problem, and the antistatic agent has the advantages of strong adsorption force and reducing the surface resistance of the electrostatic protection chip of plastic products.

2, the first contact with the chip electrostatic protection chip things must be anti-static treatment. Workers need to wear gloves, gloves, anti-static wrist strap, work clothes, work shoes, floorBoard. This is a whole anti-static process. If transported, put the chip on the shielding tape, turnover box, and transport the turnover car. Let's wait. Are need to pay attention to. Societe Generale Zhuo Hui, global service we can do better! You can add QQ chat.

3, the chip should be placed in the anti-static component box, can not be stacked at will, take it with anti-static tweezers, can not directly use the hand. It is not only important to store chips, but also to transport them by an antistatic transport vehicle. For human protection, wear antistatic clothes, gloves, and shoes.

4, so that the chip will not be caused by high dischargeDamage by voltage or high current. This technique has been shown to be effective in limiting the ESD sensitivity of packaged semiconductor devices. The human body is one of the main static power supplies, chip production workshop personnel and equipment need to have more stringent electrostatic protection measures. Wear ESD preventive tools, such as an ESD wrist strap, ESD clothes, and ESD shoes, and take regular training.