In 2009, Huawei Hisilx's first mobile phone chip Hi3611 (K3V1) was launched, which was very immature.
In 2012, Huawei Hisilicon K3V2 was released with a 40nm process. At that time, Yu Chengdong faced a lot of criticism and applied it to his own D2, P2, P6 and other mobile phones, and supported the development of Kirin chips in the way of mass application.
In 2014, Huawei released the Kirin 910. The 28nmHPM process is used to integrate the self-developed Balong710 baseband for the first time, which is used in Huawei P6S mobile phones. Thanks to the upgraded technology and GPU (in Mali), everyday use is finally possible. Subsequently, Huawei iterated an overclocked version of the Kirin 910T, which was used on the P7 and sold well.