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芯片封装厂ichaiyang 2024-05-30 14:12 55
1, Chip naming: alphanumeric letter rule 2, The main role of chip package 3, China Top 10 chip companies 4, cob light source packaging factory work 5, Semiconductor Encapsulati...

Chip packaging factory (Chip packaging manufacturer ranking)

Chip naming method: alphanumeric letter rule

There are too many ways to name the chip chip packaging factory , which is generally an alphanumeric letter in front of the letter is the abbreviation of the chip manufacturer or a chip series. Like MC started most of MOTOROLA's chip packaging factory , MAX started most of the United States Letter. The middle number is the functional model. Like MC7805 and LM7805, it can be seen from the 7805 that their functions are output 5V, but the manufacturers are different.

Intel chipsets are often divided into series, such as 84869194975, etc. Each model in the same series is distinguished by letters, and there are certain rules for naming. Mastering these rules can quickly understand the positioning and characteristics of the chipset to a certain extent: From the 845 series to the 915 series, PE was the mainstream version before, no integrated graphics card, support for the mainstream FSB and memory at the time, support for AGP slots.

The specific model number is usually four digits, the first digitRepresents product iterations, such as the 7000 series; The second number symbolizes market positioning, such as 7 Ryzen 7 series; The third number represents the technical architecture, for example, the 7000 series may use Zen 4 or Zen 3; The fourth number ranges from 0 to 5, indicating the degree of segmentation, and the higher the value, the stronger the performance.

Xeon W series, the above are all Xeon series processors, generally arranged according to the E series level, the higher the number, the higher the performance, V is the level of the version, the higher the number, the new version. While clearly different letters represent different applicability, each series has corresponding advantages, like swimmingThe attribute points in the play, like the intelligent mage with high strength, the warrior with high physical strength, the processor prefix is also differentiated according to the processor performance.

Naming rules for Gigabyte motherboards The numbers of Gigabyte motherboards all start with "GA-", taken from the English logo of Gigabyte, followed by numbers and English letters, to distinguish the specifications of specific motherboards. The number is composed of five parts: "GA-", "CPU type supported", "chipset model used by the motherboard", "board type used" and "suffix (technical characteristics)".

Chip packageMain function

Protective components: The package provides a physical layer of protection against the external environment such as dust, moisture, chemicals, and mechanical damage. This is essential to ensure the reliability and long life of components. Mechanical support: The package provides not only protection, but also mechanical support for the components. This is essential for handling and installing components, especially when manufacturing and assembling electronic devices.

Physical protection: The package provides physical protection for the internal electronic components against damage from dust, moisture, chemicals, etc. This pairIt is important to improve the stability and life of the device. Connecting pins or solder balls: During the packaging process, pins or solder balls are designed on the housing, which are used to connect the circuit inside the chip and the external electronic system to achieve signal input and output.

package function: chip signal transmission; Protection chip; Heat dissipation; Physical support. In addition, the chip design of each company must be different, so how to let customers choose these different chips? Maybe this one is designed this way, that one is designed that way, and then it will be completely different.

First, the package can provide the necessary things for the chipPrinciple protection. Chips are the heart of microelectronics, consisting of billions of tiny transistors that are highly sensitive to physical, chemical and electrical stimuli from the outside world. Unpackaged chips are exposed to the external environment and are easily affected by various factors such as dust, moisture, chemicals, electrostatic discharge, and mechanical shock, resulting in performance degradation or even damage.

China's top Ten chip enterprises

China's top ten semiconductor companies are ranked as follows: Weil: one of the world's top three CMOS image sensor chip design companies, allThe world's second largest automotive CIS manufacturer, founded in 2007, headquartered in Shanghai. Zigungrui: Headquartered in Shanghai, it is one of the enterprises that fully master the all-scene communication technologies such as 2G/3G/4G/5G, Wi-Fi, Bluetooth, TV FM, satellite communication, etc.

The top ten chip manufacturers in China are SMIC, Weil, NAURA, China Micro Corporation, Zhaoyi Innovation, Wentai Technology, Shanghai Silicon Industry, Unigunigunwei, Nano Micro, China Resources Micro and so on.

China's top ten semiconductor companies include: WeIL Shares: as the world's top three CMOS image sensor coresOne of the chip design enterprises, Weil shares was founded in 2007, headquartered in Shanghai, providing protection devices, power devices, power management devices, analog switches and other product lines, products are widely used in mobile phones, computers, TV, communications, security, vehicle, wear, medical and other fields.

Shenzhou Loongson GPU is jointly developed by the Institute of Computing Technology of the Chinese Academy of Sciences and Shenzhou Technology Company, which can provide efficient graphics performance, support open source software and API interfaces, and is the first GPU chip launched in China.

How is the cob light source packaging factory working

1, that electronic factory cob good dry. The electronics factory is mainly engaged in the production, processing, assembly, packaging and distribution of the electronic products chip packaging factory , including the production and assembly of electronic components such as mobile phones, computers, televisions. The work content is mainly assembly line operations chip packaging factory , such as locking screws, tape, labeling, packaging, shipping and so on.

2, cob light source packaging factory work well. cob light source packaging factory work to buy five insurance, the 15th of each month, the normal salary, a good working environment, work eight hours a day to get off work, rarely overtime. COB package full name chip on board package (ChipsonBoard, COB), is a technology for chip packaging factory to solve the LED heat dissipation problem. The bare chip is attached to the interconnect substrate with conductive or non-conductive adhesive, and then it is electrically connected by lead bonding.

3, good. Business scopep>

Innovation: Fabless Semiconductor Company, founded in 2005, is committed to developing advanced memory technology and IC solutions. Mullinsen: Set LED packaging and LED application products as one, was established in 1997. Geke Micro: CMOS image sensor chip, DDI display chip design company, founded in 2003. Shilanwei: Integrated circuit chip design and manufacturing (IDM) enterprise, founded in 1997.

Zhaoyi Innovation: Founded in 2005, Zhaoyi Innovation is a fabless semiconductor company dedicated to the development of advanced semiconductorsMemory technology and IC solutions. Mullinsen: Founded in 1997, Mullinsen Co., Ltd. integrates LED packaging and LED application products, covering LED semiconductor materials, new application products and innovative business.

The top ten semiconductor companies in China are Shenzhen Hisilicon Semiconductor, Shenzhen Haowei Technology Group, Beijing Zhixin Microelectronics Technology, Shenzhen Zhongxing Microelectronics Technology, Tsinghua Unigroup Zhanrui, Huada Semiconductor, Shenzhen Huidin Technology, Geke Microelectronics, Hangzhou Shilan Microelectronics, Beijing Zhaoyi Innovation Technology.