1, secondly, packaging helps the thermal management of the chip. The chip will generate heat during operation, and if it cannot effectively dissipate heat, it may cause the chip temperature to be too high, which will affect its performance and reliability. The packaging material usually hasCertain thermal conductivity can conduct the heat generated by the chip to the external environment, and auxiliary cooling devices such as heat sinks or fans on the package can further improve the heat dissipation efficiency.
2, the chip package is the shell used to install the semiconductor integrated circuit chip, which has the role of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance.
3, heat dissipation. The components, components and modules of integrated circuits will generate certain heat when they work for a long time. Chip packaging is to use the good thermal conductivity of packaging materials to effectively dissipate the heat generated between circuits, so that the chip is at a suitable working temperatureIt can work normally and meet the requirements of various performance indicators, and will not cause circuit damage due to excessive accumulation of working environment temperature. (4) Circuit protection.
4, package function: chip signal transmission; Protection chip; Heat dissipation; Physical support. In addition, the chip design of each company must be different, so how to let customers choose these different chips? Maybe this one is designed this way, that one is designed that way, and then it will be completely different.
5, an important indicator to measure whether a chip packaging technology is advanced or not is the ratio of the chip area to the package area, and the closer the ratio is to 1, the better. Encapsulation timeIP20, the number indicates the number of pins. This package is suitable for manual welding on the PCB board. QFP (Quad Flat Package) package: QFP package has four sides, each side has a pin, in a flat shape.
Width: 12 Height: 82 Diameter: 57 Hole diameter: 0. Pin spacing: 5 line spacing: 124. According to Baidu query: at89c51 microcontroller package size width: 12 height: 82 diameter: 57 drilling diameter: 0. Pin spacing: 5 lines: 124.
0201 Package: itThe dimensions are 0.6mm x 0.3mm. 0402 package: Its dimensions are 0mm x 0.5mm. 0603 package: Its dimensions are 6mm x 0.8mm. 0805 package: Its dimensions are 0mm x 25mm. 1206 package: Its dimensions are 2mm x 6mm. In addition, there are also larger size patch resistors, such as 121812010 and so on.
Two-side pin flat package. Yes SOP Another name for chip package (see SOP). The term used to be used, but it is no longer used. DIC (dual in-line ceramic package) Another name for ceramic DIP (including glass seal) (see DIP). 1DIL (dual in-line) DIP (see DIP). European semiconductor manufacturers use this name. 1DIP (dual in-line package) Dual in-line package.
Various semiconductor package shapesFeatures and advantages of Chip package : DIP dual in-line Package DIP (DualIn-line Package) refers to the integrated circuit chip that is packaged in the form of dual in-line package, and the vast majority of small and medium-sized integrated circuits (ics) use this package form, and the number of pins is generally not more than 100. A CPU chip in a DIP package has two rows of pins that need to be plugged into a chip socket with a DIP structure.
In the world of electronic design, choosing the right chip package is like fitting
Packages are broadly divided into two categories: DIP in-line and SMD patch forms. The details are: PFPF (plastic fla)t package) Plastic flat package. Another name for plastic QFP (see QFP). MSP (mini square package) Another name for QFI (see QFI), it was often called MSP in the early stages of development. QFI is the name prescribed by the Japanese Electronic Machinery Industry Association. LQFP (low profile quad flat package) Thin QFP.
TO-3 (Transistor Outline 3) and TO-5 (Transistor Outlin)e 5) are two different package types commonly used in the packaging of semiconductor devices. There are the following differences between them: Package size: TO-3 package is larger than TO-5 package. The TO-3 measures approximately 151 mm x 234 mm, while the TO-5 measures approximately 16 mm x 124 mm.
Semiconductor packaging is the process of encapsulating a semiconductor chip in a protective housing to provide mechanical protection, electrical connectivity and thermal management. The following are some common semiconductor packaging devices: Welding devices: Used to connect semiconductor chips to package substrates or leadsLine frame on. Common welding techniques include Wire Bonding, Flip Chip Bonding, and Die attaching.
1, aluminum wire connection The circuit that closely connects the components together is made of aluminum wire. This material has good electrical conductivity and plasticity chip package , can meet the high density wiring requirements of the chip. The heat resistance of the chip is closely related to the material of the silicon semiconductor, the manufacturing process and the heat dissipation capacity of the package.
2, the magical journey of semiconductor chips from internal design to the protection of the outside world, package testing plays a key role. In this process, we delve into chip packaging to understand how CP test equipment ensures chip quality, as well as its purpose and challenges. Packages, like the armor of chips, are divided into ceramic, metal, and plastic types, each with its own unique advantages and disadvantagesg> Chip packaging : Ceramic packaging provides excellent insulation, metal is known for efficient heat dissipation, and plastic packaging is lightweight and cost-effective.
3. First, the wafer cutting technology splits large wafers into tiny chip particles through precise manipulation, using anti-static materials and precision cooling. The chip is then pasted to the lead frame via a silver paste, ensuring good heat transfer. The gold wire bonding completes the physical connection between the chip and the pin, and the electrical connection is realized through high temperature sintering and stretching technology.
4, packaging, the past manual cumbersome, now automation strides forward. Cutting, single chip attachment, interconnecting (including lead bonding and flip chips), forming and testing, each step has witnessed a technological leap forward. From the low cost of WLP to the high I/O of 3D, packaging technologies such as 2D, 5D and 3D show the innovative evolution of packaging. In the field of 3D packaging, TSV and micro-convex technology is the finishing touch. 5, packaging on a wafer to make a chip needs to go through thousands of processes, from design to production takes more than three months. In order to remove the chip from the wafer, it is cut into individual chips with a diamond saw.
6,The precise journey of the semiconductor process: From silica sand to the heart of microelectronics/The remarkable journey of semiconductor manufacturing is divided into eight key steps, each of which is like a delicate work of art, shaping the magical world of the chip: The Source of the Wafer / : The birth of high-purity silicon begins with silica sand, which is refined into monocrystalline silicon ingot and then cut into wafers, each piece carrying infinite possibilities and marking the blueprint of future circuits.