First consult the chip data manual for pin functions and electrical specifications. Rotate the multimeter to the resistor to ensure that the chip is powered off to prevent baby injury! Touch the correct pin with the probe as instructed in the data manual. The multimeter displays the value, which is the resistance valueC 'mon! Voltage Measurement Tips Understand power requirements and operating voltage ranges. Switch to DC voltage and select the appropriate voltage range. Connect the chip to the power supply. Use a probe to measure the voltage.
Read the measured value: Read the resistance value displayed on the multimeter. If there is resistance between the chip pins, the multimeter will display a value. Voltage measurement: Determine the chip type: Understand the power requirements and operating voltage range of the chip. Set the measuring range: Turn the multimeter knob to the DC Voltage measuring gear and select an appropriate voltage range. Power on: If needed, turn on the coreConnect the piece to the appropriate power supply.
To verify the function of the "generating core", a set of synthesizable Verilog code is written based on the data comparison between the input excitation provided and the expected output response. The code is designed in strict accordance with the timing requirements of the "electric core".
Obirch technology uses test points inside the chip for testing. These test points are usually left by the chip designer when designing the chip, and are used to test the circuit and signal of the chip. Obirch technology uses test points to connect chips to test equipment. The test equipment will inject it into the chipCurrent or voltage signal, and measure the response signal inside the chip.
Six-pin chip measurement methods are as follows: First, the selection of test equipment, the use of digital multimeter or oscilloscope for measurement, to ensure the accuracy of the test. Then, the corresponding pins are tested, and the corresponding functions of each pin are clearly defined against the pin orientation diagram of the six-pin chip. Secondly, to test the access of the power supply, the six-pin chip needs to be connected to the power supply for testing, and is correctly connected according to the polarity requirements of the power supply.
Chip inspection Microscopy: whether there is mechanical damage and pitting pits on the surface of the material (lockhill) Chip size and electrode size areg>, select a range that is slightly greater than the expected resistance value of the chip to test what instrument the chip uses. Disconnect the power supply: Before measuring the resistance, make sure the chip is powered off to avoid damaging the chip or multimeter. Connect the test pin: Connect it to the chip pin using the multimeter's probe. According to the data manual, What instrument to test the chip with Know which pins should be measured.
Starting with the original material (wafer), the process flow of the package test plant begins with wafer surface coating (WTP). Pick upWafer back grinding (GRD), wafer back polishing (polish), wafer back coating (W-M). After that, wafer surface removal (WDP), wafer baking (WBK), and wafer cutting (SAW) are performed. The wafer is cleaned after cutting (DWC) and inspected after cutting (PSI).
According to the framework diagram of the designed functional test platform, we completed the design of the schematic diagram and PCB, and finally successfully built a system-level platform that can perform functional testing on the "electric core".
The positive and negative resistance values between the pins of the IC chip to the ground are measured by off-line detection. It is compared with a good IC chip to find the fault point. On-line detection of DC resistance is the same as offline detection.
Read the measured value: Read the voltage displayed on the multimeter. Ensure that the voltage value is within the normal operating range of the chip. Continuity test: Set measuring range: Turn multimeter knob to continuity test file. Disconnect the power supply: Before performing the continuity test, ensure that the chip isIn a state of power failure. Connect test pins: Use the probe of the multimeter to connect it to each of the two pins being tested.
Offline detection: The positive and negative resistance values between the pins of the IC chip are measured. It is compared with a good IC chip to find the fault point. Online detection: To disconnect the power supply on the circuit board to be tested, the internal voltage of the multimeter should not be greater than 6V, and pay attention to the influence of the periphery when measuring. Such as potentiometer connected with IC chip, etc. Ac operating voltage: Use a multimeter with dB file to measure the AC voltage approximation of the IC.
Mainboard maintenanceMaintenance method and IC good or bad judgment method Check board method: 1. Observation method: there is no burning, burning, foaming, plate surface broken line, socket rust. 2. Meter measurement: Whether +5V, GND resistance is too small (below 50 ohms). 3. Power inspection: For the clear broken board, the voltage can be slightly increased by 0.5-1V, and the IC on the board can be rubbed by hand after starting up to make the chip in question hot, so as to perceive it.
. In the circuit DC resistance detection method This is a multimeter ohm gear, directly on the circuit board to measure the positive and negative DC resistance value of the IC pins and peripheral components, and with normal dataCompare methods to find and determine faults. When measuring, pay attention to the following three points: (1) Before measuring, disconnect the power supply to avoid damage to the meter and components during the test.
Touch the correct pin with the probe as instructed in the data manual. Multimeter display value, is the resistance value! Voltage Measurement Tips Understand power requirements and operating voltage ranges. Switch to DC voltage and select the appropriate voltage range. Connect the chip to the power supply. Use a probe to measure the voltage. Make sure the voltage is in the normal operating range. Continuity Test Ultimate Tip Switch to the Continuity test file.
Semiconductor packaging equipment includes printing presses, solidifying machines, reflow soldering, light inspection, rework, molding, and cutting. Among them, the solidification machine is the key process in the packaging process What instrument is used for testing the chip , it is recommended that the pixel solidification machine of Zhuoxing Semiconductor What instrument is used for testing the chip , the new solidification technology - pixel solidification, reduce the solidification path, While improving the solidification speed, the solidification yield and accuracy are also guaranteed, and the through yield is greater than 9999%.
Track and Scanner in semiconductor manufacturing are both common devices, but their roles and functions are different. Track is a device in semiconductor manufacturing that is mainly used for wet processing of chips. Track is usually composed of multiple processing units, including cleaning units, etching units, gluing units, etc.
Semiconductor testing runs through the entire manufacturing process, and the test machine, the sorting machine, and the probe station are its core equipment. Semiconductor testing usually mainly refers to the performance test of the back channel in the semiconductor process, and the broad semiconductor testing also includes the process detection of the front channel. measuringThe test process runs through the three major processes of semiconductor design, manufacturing, packaging and testing, which is one of the keys to improve the level of chip manufacturing and the management of product yield.
minutes, the equipment is mainly Agilent and TEPCO test chip with what instrument ; 2, in the wafer manufacturing process monitoring film thickness, line width, etc., film thickness is 13 points, line width is 9 points; 3, the optical lens chip will also test the warpage degree and overall thickness of the wafer, which should be combined with the repreparation of the back-end chip; 4, when testing the chip (non-productive normal detection), it will also test NBTI and TDDB, GOV, etc.; 5, other tests according to chip characteristics.
Semiconductor packaging equipment generally have solder paste printing machine, solid crystal machine, reflow welding, light detection, repair equipment, etc., of which the most core is solid crystal machine, What instrument is used for testing chips Our company's production line is Zhuoxing Semiconductor solid crystal machine, very easy to use, the performance is very powerful.
The magical journey of semiconductor chips From internal design to protection of the outside world, package testing plays a key role. In this course, we take an in-depth look at how CP test equipment is ensuredChip quality, and its purpose and challenges.