2, a glimpse of the tiny mystery of the chip world: the deep analysis of the process process at the bottom of the information technology, the chip process is like a precision micro-world, which determines the speed, efficiency and performance of the chip production. In simple terms, the process is the key step in semiconductor manufacturing, which determines the characteristics of the circuit, including the size and performance of the transistor.
3, mainly manufacture digital lettersProcessing chip, from start to finish generally requires 1500 processing steps. First, in the complex component assembly, chip production they will be responsible for transporting the chip to the various workstations, and then use photolithography to design the circuit on the chip, first coating the lens with sensitive chemicals, which will harden when exposed to ultraviolet light, in a closed dark room, The light will first pass through the shadow of the circuit design.
Precision chip itThe manufacturing process is very complex. First, the chip design, according to the design needs, the generated "pattern" 1, the raw material of the chip wafer wafer composition is silicon, silicon is refined by quartz sand, the wafer is the silicon element to be purified (9999%), and then some pure silicon into silicon rod, become the quartz semiconductor manufacturing integrated circuit material. Slicing it is the wafer that is specifically needed for chip production.
The entire chip manufacturing process is divided into many small steps. First, the wafer is put into a Furnace at a temperature of 1000 ° C to oxidize the wafer surfaceTo form a silica insulation layer. Wafers are oxidized in a heating furnace and then photoresist is applied to the surface of the wafers in preparation for wafer exposure. From 1949 to 1957, Werner Jacoby, Jeffrey Dummer, Sidney Darlington, and Yasuo Tarui all developed prototypes, but the modern integrated circuit was invented by Jack Kilby in 1958. He won the Nobel Prize in Physics in 2000, but Robert Noyce, who also developed the modern practical integrated circuit at the same time, died earlier than 1990.
July, Noyce researchThe diffusion technology of silica (the main component of sand is silica) and the isolation technology of PN junction are issued, and the aluminum strip connection is creatively made on the oxide film, so that the components and wires are integrated into one, and the plane production process of semiconductor chips is developed, which lays a solid foundation for industrial mass production. Because the commercial prospects of silicon are far better than germanium, Noyce has always set his sights on silicon chips.
Raw materials for single Wafer: The raw materials for chip production are mainly Silicon wafers, which are a round sheet of high-purity silicon. Lithography: on a silicon waferThe circuit pattern that needs to be made is exposed and repaired with special equipment, that is, Photolithography, and then the pattern is formed chemically. This process needs to be repeated many times, gradually forming a complex circuit pattern.
China's most powerful chip companies: 1 Huawei hisilicon: Hisilicon Semiconductor is a semiconductor company, founded in 2004, the company's headquarters in Shenzhen. Hisilicon Semiconductor is recognized as the strongest chip company in China, and is already the world's first-classSemiconductor companies, its well-known Huawei Kirin processor, Balon series communication baseband and so on.
Founded in September 1997, headquartered in Hangzhou, China, is one of the largest integrated circuit chip design and manufacturing (IDM) enterprises in China. The IC chip production line built by Shilan Microelectronics in Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in the chip manufacturing capacity of less than and equal to 6 inches.
JCET Technology (600584) : The company is engaged in integrated circuits, discrete device packaging and testing